2025新材料前沿交叉国际暑期学校开班通知
Global Summer School on New Materials Interdisciplinary Frontiers (2025)
1、主办方简介About the MSE
开云手机入口开云手机入口始创于1952年，经过几代人的不懈努力，现已发展成为享誉全球的材料科学研究中心与人才培养高地。目前，开云手机入口材料专业在ESI材料科学领域排名第12位，入围ESI全球前万分之一学科，U.S. News世界大学材料科学排名第26位。
Founded in 1952, the School of Materials Science and Engineering at Huazhong University of Science and Technology (HUST) has evolved into a globally recognized center for materials science research and talent cultivation. Our materials science program currently achieves:
✓ 12th globally in ESI Materials Science
✓ Top 0.01% worldwide (ESI ranking)
✓ 26th globally in U.S. News & World Report's Materials Science rankings
2、项目时间和地点Program Dates & Venue
2025年7月1日（周二）-7月5日（周六），开云手机入口主校区
Tuesday, July 1 - Saturday, July 5, 2025, Main Campus of HUST (Wuhan, China)
3、招生对象Target Group
全球材料类相关专业的本科生、硕士生及博士生（计划招收40名左右学员，由开云手机入口材料学院教授组成的专家委员会根据申请者的综合素质选拔入围学员名单）
Undergraduate/Master/PhD students in materials-related disciplines worldwide
(~40 seats available; selection by HUST faculty committee)
4、项目亮点Program Highlights
前沿学科交叉：覆盖光电材料、能源材料、金属材料、智能材料等前沿交叉领域
国际师资阵容：海外院士及顶尖学者领衔，全英文教学环境
实践与文化体验：前沿实验室参观+文化实践活动
学术证书：完成课程颁发结业证书
Interdisciplinary frontiers: Optoelectronic/Energy/Metallic/Smart Materials
Global faculty: Led by international academicians & top scholars (English instruction)
In-depth experience: Lab tours + Cultural activities
Certificate: Official completion certificate awarded
5、授课师资Faculty
本课程将邀请巴基斯坦科学院院士，及新加坡国立大学、南加州大学、圣彼得堡国立大学等国内外知名高校的教授授课。
The program will feature lectures by academicians from the Pakistan Academy of Sciences, as well as professors from renowned domestic and international universities such as the National University of Singapore, the University of Southern California, and St. Petersburg State University, etc.
6、费用情况Fees
零学费：课程及参观实践免费
自理费用：食宿、国际旅费、签证费
No tuition fee: Courses & visits covered
Self-funded: Accommodation, meals, travel, visas
7、报名须知Application
8、咨询联系Contact
9、日程安排参考Schedule Reference
7月1日 |
开营仪式 讲座1: 宽带隙半导体纳米结构 |
7月2日 |
讲座2: 数据驱动的人机协同拆卸技术在报废产品中的应用 实验室参观 |
7月3日 |
讲座3: 类脑计算芯片关键材料 讲座4: 钙钛矿发光材料 |
7月4日 |
讲座5: 先进金属材料 讲座6: 高性能金属材料3D打印技术 |
7月5日 |
文化体验活动 结营仪式 |
July 1 |
Opening Ceremony Lecture 1: Wide band gap semiconductor nanostructures |
July 2 |
Lecture 2: Data-driven human robot collaborative disassembly for end-of-life products Lab tour |
July 3 |
Lecture 3: Key materials for brain-like computing chips Lecture 4: Halide perovskite light-emitting materials |
July 4 |
Lecture 5: Advanced metallic materials Lecture 6: Additive manufacturing of high-performance metallic materials |
July 5 |
Cultural Experience Activities Closing Ceremony |
